PayPay | Backend Engineer | Interview Experience | Sepetember 2026
Summary
I interviewed for a Backend Engineer role at PayPay in September 2026, completed an OA, Technical Fitment, HLD, and DSA rounds, and received a rejection.
Full Experience
Current 25 LPA base 4.3 YOE
OA 2 DSA questions.
Round 1 - Technical Fitment round Some questions regarding my projects. Questions regarding kafka, paritions, backpressure etc. Some DB questions for isolation levels. 1 DSA problem - next greatest element in circular array.
Round 2 - HLD Round Some 10 min project discussion. Design a coupon generation and application service. Some questions in the design like make it scalable, remove single point of faliures etc.
Round 3 - DSA Round Only 1 DSA question - some problem regarding sweep line algorithm. The interviewer was wierd as I answered the problem in very less time. He then asked me to prove my solution for 15 min. After that another problem to design a library to generate a random function. Then what monitoring parameters will you have in it. Then a basic LLD discussion for the design pattern for the library. I had answered all the problems that they asked but I gave the DSA solution in CPP.
Verdict: I got a rejection mail after 1 week. I think because I answered DSA problem in CPP but they said I can write code in any language and I also know Java which they want.
Other Interview Experiences: Tekion | PhonePe | NinjaVan | Incred | Sumo Logic
Interview Questions (1)
Next Greatest Element in Circular Array
Given a circular array of integers, for each element find the next greater element in the order of traversal. If no greater element exists, output -1 for that position.